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3 V SUPER MINIMOLD L-BAND UPC2756TB SI MMIC DOWNCONVERTER
FEATURES
* HIGH DENSITY SURFACE MOUNTING: 6 Pin Super Minimold or SOT-363 package * WIDE BAND OPERATION: RF = 0.1 to 2.0 GHz IF = 10 to 300 MHz * ON BOARD OSCILLATOR * SUPPLY VOLTAGE: VCC = 2.7 TO 3.3 V
RF Input IF Output
INTERNAL BLOCK DIAGRAM
DESCRIPTION
NEC's UPC2756TB is a silicon MMIC integrated circuit manufactured using the NESAT III process. The device consists of a double balance mixer, an IF amplifier and a built-in LO. this device is suitable as a L-BAND downconverter for the receiver stage of wireless systems. The UPC2756TB is pin compatible and has comparable performance as the larger UPC2756T, so it is suitable for use as a replacement to help reduce system size. The IC housed in a 6 pin super minimold or SOT-363 package. NEC's stringent quality assurance and test procedures ensure the highest reliability and performance.
LO1
LO2
VCC
GND
ELECTRICAL CHARACTERISTICS (TA = 25C, Vcc = 3 V, ZL = Zs = 50 )
PART NUMBER PACKAGE OUTLINE SYMBOLS ICC fRF fIF CG NF PSAT OIP3 ISO PN RTH (J-A) PARAMETERS AND CONDITIONS Circuit Current (no signal) RF Frequency Response (3 dB down from the gain at fRF = 900 MHz, fIF = 150 MHz) IF Frequency Response (3 dB down from the gain at fRF = 900 MHz, fIF = 150 MHz) Conversion Gain1 Noise Figure fRF = 900 MHz, fIF = 150 MHz fRF = 1.6 GHz, fIF = 20 MHz fRF = 900 MHz, fIF = 150 MHz fRF = 1.6 GHz, fIF = 20 MHz fRF = 900 MHz, fIF = 150 MHz fRF = 1.6 GHz, fIF = 20 MHz UNITS mA GHz MHz dB dB dB dB dBm dBm dBm at RF pin at IF pin dBm dBm dBc/Hz C/W -11 -15 MIN 3.5 0.1 10 11 11 300 14 14 10 13 -8 -12 +4 -35 -23 -68 325 17 17 13 16 UPC2756TB S06 TYP 6.0 MAX 8.0 2.0
Saturated Output Power2
SSB Output 3rd Order Intercept Point fRF = 0.8~2.0 GHz, fIF = 100 MHz LO Leakage, fLO = 0.8 ~2.0 GHz Phase Noise3, fOSC = 1.9 GHz Thermal Resistance (Junction to Ambient) Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB
Notes: 1. PRF = -40 dBm. 2. PRF = -10 dBm. 3. See Application Circuit.
California Eastern Laboratories
UPC2756TB ABSOLUTE MAXIMUM RATINGS1 (TA = 25C)
SYMBOLS VCC PT TOP TSTG PARAMETERS Supply Voltage Total Power Dissipation2 UNITS V mW C C RATINGS 5.5 200 -40 to +85 -55 to +150
RECOMMENDED OPERATING CONDITIONS
SYMBOLS VCC TOP PARAMETERS Supply Voltage Operating Temperature UNITS V C MIN 2.7 -40 TYP MAX 3.0 +25 3.3 +85
Operating Temperature Storage Temperature
Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85C).
TEST CIRCUIT
0.1 F 3 LO1 LO2 4 VCC 5 C4 C3 0.1 F 3V
IF OUTPUT LO INPUT
0.1 F C2
2 0.1 F
RF INPUT
GND
1 C1
RFIN IFOUT 6 0.1 F C5
PIN FUNCTIONS
Pin No. 1 Symbol RFIN Applied Voltage (V) - Pin Voltage (V) 1.2 Description Signal input pin to double balancec mixer. This pin must be coupled to the signal source with a blocking capacitor.
1
Internal Equivalent Circuit
VCC
2
GND
0
-
Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. These pins are both the basecollectors of a differential amplifier configured to oscillate when equipped with an external tank resonator circuit. Each pin must be coupled to the tank circuit with a blocking capacitor. In the case of an external LO source, bypass the unused pin with a capacitor to ground.
VCC
3
LO1
-
1.2
3
4
4 5
LO2 VCC
- 2.7 to 3.3
1.2 - Power supply pin. This pin should be externally equipped with a bypass capacitor to minimize ground impedance. Output of single-ended push-pull IF buffer amplifier. This is an emitter-follower output with low impedance. This pin must be coupled to the next stage with a blocking capacitor.
VCC
6
IFOUT
-
1.7
6
UPC2756TB TYPICAL PERFORMANCE CURVES (TA = 25C)
CIRCUIT CURRENT vs. VOLTAGE
10 No input signal
10 No input signal VCC = 3.0V
CIRCUIT CURRENT vs. TEMPERATURE
Circuit Current, Icc (mA)
Circuit Current, Icc (mA)
8
8
6
6
4
4
2
2
0 0 1 2 3 4 5 6
0 -40 -20 0 +20 +40 +60 +80 +100
Supply Voltage, Vcc (V)
Operating Temperature, TOP (C)
CONVERSION GAIN AND NOISE FIGURE vs. RF INPUT FREQUENCY
25
30
CONVERSION GAIN vs. IF OUTPUT FREQUENCY
VCC = 3.0V PRFin = -55 dBm PLOin = -10 dBm fRF = 1.6 GHz
Conversion Gain, CG (dB)
CG 15 VCC = 3.0V
VCC = 3.3V
Conversion Gain, CG (dB)
20
25
20
VCC = 2.7V 20 NF VCC = 3.0V
10
15
15
10
PRFin = -55 dbm PLOin = -10 dbm fIF = 150 MHZ (Low-Side Lo) 0.5 1.0
VCC = 2.7V
10
5
VCC = 3.3V 5 1.5 2.0
0 1 2 5 10 20 50 100 300
RF Input Frequency, fRF (GHz)
IF Output Frequency, fIF (GHz)
LO LEAKAGE AT RF PIN vs. LO FREQUENCY
0
0
LO LEAKAGE AT IF PIN vs. LO FREQUENCY
LO Leakage at IF Output Pin (dBm)
LO Leakage at RF Input Pin (dBm)
VCC = 3.0 V PLOIN = -10 dBm -10
VCC = 3.0V PLOIN = -10 dBm -10
-20
-20
-30
-30 -40
-40
-50
-50
-60 1.4 1.6 1.8 2.0
-60 0.8 1.0 1.2 1.4 1.6
LO Input Frequency, fLO (GHz)
LO Input Frequency (GHz)
UPC2756TB TYPICAL PERFORMANCE CURVES (TA = 25C)
IF Output Level, PIFOUT (dBm) 3rd Order Intermodulation Distortion, IM3 (dBm)
IF OUTPUT LEVEL AND IM3 vs. RF INPUT LEVEL IF OUTPUT LEVEL AND IM3 vs. RF INPUT LEVEL
+20 +10 0 -10 -20 -30 -40 -50 -60 -70 -80 -60 -40 -20 0 fRF1 = 2.0 GHz fRF2 = 2.005 GHz fLO = 1.9 GHz VCC = 3.0 V
IF Output Level, PIFOUT (dBm) 3rd Order Intermodulation Distortion, IM3 (dBm)
+20 +10 0 -10 -20 -30 -40 -50 -60 -70 -80 -60 -40 -20 0 fRF1 = 900 MHz fRF2 = 905 MHz fLO = 800 MHz VCC = 3.0 V
RF Input Level, PRFIN (dBm)
RF Input Level PRFIN (dBm)
VCO OSCILLATION FREQUENCY vs. TUNING VOLTAGE
VCO PHASE NOISE (fVCO = 774.425 8 MHz center)
ATTEN 10 dB RL -40.0 dBm 10 dB/ MKR -53.16 dB 10.0 kHz VCC = 3 V Vtune = 3 V TA = +25C Monitor at pin 6 D
VCO Oscillation Frequency, fVCO (GHz)
2.5
L = 7 nH 2.0 L = 15 nH 1.5 L = 30 nH L = 50 nH 1.0
K MKR 10.2 kHz -53.16 dB
0.5 0 5 10 15 20 25
CENTER 774.425 8 MHZ RBW 1.0 kHz ++ VBW 100 Hz SPAN 100.0 kHz SWP 3.0 s
Tuning Voltage, VTU (V)
VCO PHASE NOISE (fVCO = 1.639 194 2 MHz center)
ATTEN 10 dB RL -40.0 dBm 10 dB/ MKR -40.34 dB 10.2 kHz VCC = 3 V Vtune = 3 V TA = +25C Monitor at pin 6 MKR D 10.2 kHz -40.34 dB
K
CENTER 1.639 194 2 GHZ RBW 1.0 kHz ++ VBW 100 Hz
SPAN 100.0 kHz SWP 3.0 s
UPC2756TB TYPICAL SCATTERING PARAMETERS
5 23 4 1
1 2 6 5 4 3
RF Port VCC = 3.0 V 1: 2: 3: 4: 5: 6: 100 MHz 500 MHz 900 MHz 1500 MHz 1900 MHz 3000 MHz
Start Stop 519.8 59.3 38.3 31.5 28.5 25.7
0.10 GHz 3.10 GHz
RF Port VCC = 3.0 V 1: 2: 3: 4: 5: 50 MHz 80 MHz 130 MHz 240 MHz 300 MHz
Start Stop 22.5 24.2 30.2 42.6 46.6
0.05 GHz 3.00 GHz
-j 1.1 -j 281.0 -j 157.0 -j 90.1 -j 67.9 -j 31.7
+j 6.1 +j 11.3 +j 16.6 +j 17.5 +j 15.6
SYSTEM APPLICATION EXAMPLE
RX
BPF UPC2756TB
BPF
Tuned Resonating Tank UPC2745TB PLL Frequency Synthesizer LPF VT Reference Oscillator (Crystal)
UPC2756TB OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE S06
LEAD CONNECTIONS
(Top View) (Bottom View)
C1W
2.10.1 1.250.1
3
0.2 +0.1 -0
4
4
3
2.00.2 0.65 3 1.3 0.65 2
2
5
5
2
4
1
5
6
6
1
1
6
DOT ON BACK SIDE
0.9 0.1 0.7
1. RF INPUT 2. GND 3. LO1 4. LO2 5. VCC 6. IF OUTPUT
0 ~0.1
+0.1 0.15 -0.5
APPLICATION CIRCUIT EXAMPLE
15 K D1 BIAS R1 C2
0.1F
ORDERING INFORMATION
PART NUMBER QTY 3K/Reel UPC2756TB-E3-A
L
5nH 30 nH
VARACTOR* DIODES
15 K R2 C3
0.1F
Note: Embossed Tape, 8 mm wide, Pins 1, 2, 3 are in tape pull-out direction.
3
LO1
LO2
4
0.1F
2
0.1F
GND
Vcc
5
3V
1 C1
RFIN
IFOUT
6
0.1F
C5
* Recommended Varactor Diodes:
Alpha SMV1204-4, Toshiba 1SV186 or equivalent
Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.
EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES * Headquarters * 4590 Patrick Henry Drive * Santa Clara, CA 95054-1817 * (408) 988-3500 * Telex 34-6393 * FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) * Internet: http://WWW.CEL.COM DATA SUBJECT TO CHANGE WITHOUT NOTICE 7/18/2000
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
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